Processing without grinding fluid and washing

●No grinding water used

In contrast to conventional dicing processes, the “Scribing & Breaking” process does not use grinding fluid because materials are not scraped off by the grindstone (blade) during machining. With no grinding fluid, there is also no need to wash after machining.

This process can be used for substrates that may deteriorate if exposed to moisture and is environmentally friendly.

Processing of no kerf loss (processing margin)

●Kerf utilization

Semiconductors and ceramic substrates are usually expensive materials. Materials are not
scraped off in the “Scribing & Breaking” process, which allows materials that may be discarded as kerf loss (processing margin) to be used as actual products.

This process can eliminate waste and open up possibilities for increasing the number of products

Reduced chipping (in case of glass)

●Creating cracks on the material surface layer and further developments

Hard and fragile materials, such as semiconductors, ceramics and glass tend to be prone to chippings when cut in the dicing process.
However, the “Scribing & Breaking” process creates starting cracks on the material surface layer (scribing) and propagate the cracks (breaking), which allows chippings reduce.

Reduced metal burrs and no thermal effects (e.g., alumina cross-section with electrode metal)

●No burrs or debris

Metal for electrodes in electronic component applications may be deposited on the surface/backside of a substrate.
　
Cutting by scraping off the entire metal film may cause burrs or chips to adhere to the substrate, but this concern is virtually eliminated with “Scribing & Breaking” process.
In addition, unlike laser processing, S&B processing does not create debris (melted and stuck material) because the processed area does not become hot.

Challenges other than rectangular machining (e.g., alumina circle machining)

●Tackle tough materials and shapes never before processed

BRIMATEC is taking up the challenge to process materials other than rectangular (quadrilateral) shapes in order to expand the potential for scribing and breaking.
It is in the process of developing circular processing and circular punching of glass and ceramic substrates, as well as stable processing of ultra-small C-cuts, based on the principle of "try it first" whenever BRIMATEC receives a request from customers.

BRIMATEC is excited to receive requests to process unknown materials and shapes.

Lower cost of chips for research and development

●Advantages of breaking

BRIMATEC takes advantage of S&B operation, which is a simple method of pre- and post-processing, and integrated production from procurement to marketing, to reduce the cost of chips (10 mm square) used for research and development and other purposes.

And BRIMATEC hopes to encourage the development of Japanese product development, even if just a little.