The image is a sample. The transparent resin case consists of two parts: the main body and the lid.
 
After assembly, the parts are reset in the mold and sealed by overmolding with black resin around the mating surfaces. This allows for sealing while the parts remain hollow, rather than using epoxy filling or other methods.

This is a pole-type heatsink molded from a new material that incorporates carbon and ceramics to enhance thermal conductivity and heat dissipation.
 
We molded and evaluated samples of heat-dissipating resins from various manufacturers to investigate their thermal behavior. In a sealed space, the heat rise was slower than that of an aluminum heatsink of the same shape, the thermal saturation was about 15 degrees lower, and the heat decrease was faster. Currently, there are still issues with strength, but it is a promising material for the future.

This is a chip carrier used in semiconductor-related factories. It is used in various processes such as chemical treatment and heat treatment. PEEK, one of the top-grade super engineering plastics, is used due to its wear resistance, sliding properties, heat resistance, chemical resistance, and outgassing characteristics.
 
Daipla Co., Ltd. has processed over 950 types of resins, including these ultra-high-performance engineering plastics.